A plasma cleaner hosted in the cleanroom capable of delivering variable RF power up to 300W. This machine is used to clean or activate the silicon wafer surfaces prior to resist coating. The recipe based system allows fully automated operation with precision control of gas flow rates for plasma processing. The chamber can accommodate 25 pieces of 6” Silicon wafer in one process.

 

Location: Hawken Building #50 (Cleanroom L115)

Contact: Elliot Cheng h.cheng6@uq.edu.au

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